Vehicle vision system with fastenerless lens attachment

ABSTRACT

A vehicular camera module includes a housing and an imager assembly having an imager, an imager circuit board and a lens holder. The imager is disposed at the imager circuit board. The lens holder includes a lens holding portion and an attaching portion, with the lens holding portion accommodating a lens. The attaching portion of the lens holder includes a plurality of pins that, when the attaching portion is mated with the circuit board, are received at least partially through apertures of the imager circuit board. With the pins received at least partially through the apertures, and with the lens focused and optically aligned with the imager at the imager circuit board, the pins are soldered at the imager circuit board so as to fixedly attach the lens holder at the imager circuit board to form the imager assembly. The imager assembly is attached at the housing.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 14/258,366, filed Apr. 22, 2014, which claims the filingbenefits of U.S. provisional applications, Ser. No. 61/918,290, filedDec. 19, 2013, Ser. No. 61/875,351, filed Sep. 9, 2013, Ser. No.61/823,644, filed May 15, 2013, and Ser. No. 61/815,044, filed Apr. 23,2013, which are hereby incorporated herein by reference in theirentireties.

FIELD OF THE INVENTION

The present invention relates to imaging systems or vision systems forvehicles.

BACKGROUND OF THE INVENTION

Use of imaging sensors in vehicle imaging systems is common and known.Examples of such known systems are described in U.S. Pat. Nos.8,324,552; 8,314,689; 8,222,588; 8,203,440; 7,994,462; 7,655,894;7,339,149; 7,344,261; 7,459,664; 7,423,248; 6,097,023; 5,949,331;5,670,935 and/or 5,550,677, which are hereby incorporated herein byreference in their entireties.

SUMMARY OF THE INVENTION

The present invention provides a vision system or imaging system for avehicle that utilizes one or more cameras to capture images exterior ofthe vehicle, and provides the communication/data signals, includingcamera data or image data, which may be displayed or processed toprovide the desired display images and/or processing and control,depending on the particular application of the camera and vision orimaging system. The present invention provides a camera module thathouses an imager and lens holder and lens at the windshield of vehicle.The lens holder comprises enhanced attachment means or elements thatattach the lens holder at the imager circuit board to mount the lens atthe imager. Optionally, the lens may attach at the imager circuit boardwithout use of a lens holder. The present invention provides afastenerless surface mount or surface attachment of the lens or lensholder to the imager circuit board without use of additional or separatefasteners or screws. Optionally, the present invention provides a solderattachment of the imager circuit board to a housing of the camera.

These and other objects, advantages, purposes and features of thepresent invention will become apparent upon review of the followingspecification in conjunction with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings illustrate, by way of example only, embodiments of thepresent disclosure.

FIG. 1 is a perspective view of a vehicle having a vehicular camerasystem;

FIG. 2 is a perspective view of a forward facing imager module of thevehicular camera system;

FIG. 3 is an exploded view of the forward facing imager module;

FIG. 4 is an exploded view of the imager assembly;

FIG. 5 is a sectional view of a lens holder attached at an imagercircuit board in accordance with the present invention;

FIG. 6 is a perspective view of a lens holder of an image module of thepresent invention;

FIG. 7 is another perspective view of the lens holder of FIG. 6;

FIG. 8 is a perspective view of the lens holder of FIGS. 6 and 7, shownattached at a circuit board in accordance with the present invention;

FIG. 9 is a side elevation and partial sectional view of the lens holderand circuit board assembly of FIG. 8;

FIG. 10 is a perspective view of a lens holder and lens assembly, shownwith posts attached at the lens holder for attaching the circuit boardat the lens holder in accordance with the present invention;

FIG. 11 is a side view of the lens holder and lens assembly of FIG. 10;

FIG. 12 is a view similar to FIG. 10, shown with the circuit boardsoldered at the posts after the lens is focused and aligned with theimager of the circuit board in accordance with the present invention;

FIG. 13 is a side view of the lens holder and circuit board constructionof FIG. 12;

FIG. 14 are views of the lens holder and circuit board, showing theassembly process of the present invention;

FIG. 15 is a perspective view of another imager assembly of a cameramodule of the present invention;

FIG. 16 is a side elevation of the imager assembly of FIG. 15;

FIG. 17 is a plan view of the imager assembly of FIG. 15;

FIG. 18 is an end elevation of the imager assembly of FIG. 15;

FIGS. 19A-C are exploded perspective views of the circuit element andcase mounts of the imager assembly of the present invention, showing theattachment process of the case mounts to the circuit element;

FIG. 20 is another exploded perspective view of the circuit element andcase mounts, showing one of the case mounts attached at the circuitelement;

FIG. 21 is another exploded perspective view of the imager assembly,showing an adhesive disposed at the circuit element for attaching thelens at the circuit element; and

FIG. 22 is a perspective view of the imager assembly of FIG. 21, shownwith the lens attached at the adhesive at the circuit element.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A vehicular camera system can be installed on the inside of the frontwindshield of a vehicle, such as a car, truck, bus, or van. Such acamera system may be used for a variety of functions such as objectdetection, lane keeping, and high beam control. FIGS. 1 and 2 show anexample of a vehicular camera system or module 10 configured to beattached in a front-facing manner to a vehicle 100. The camera system 10includes a housing 12 and a lens 14 having a lens barrel projectingtherefrom.

FIG. 1 shows a forward-facing position for a camera system 10 in thevehicle 100. The camera system or module 10 can be attached to thewindshield 102, as shown, such as via a frame or bracket that isadhesively attached at the windshield via a plurality of fixing elementsor attachment elements. Other positions are also possible. The camerasystem or camera module of the present invention may utilize aspects ofthe systems and/or modules described in U.S. provisional applications,Ser. No. 61/905,462, filed Nov. 18, 2013, and Ser. No. 61/901,127, filedNov. 7, 2013, and/or PCT Application No. PCT/US2013/026101, filed Feb.14, 2013, and/or PCT Application No. PCT/US2012/048993, filed Jul. 31,2012 and published Feb. 7, 2013 as International Publication No. WO2013/019795, and/or U.S. Pat. Nos. 8,256,821; 7,480,149; 7,289,037;7,004,593; 6,824,281; 6,690,268; 6,445,287; 6,428,172; 6,420,975;6,326,613; 6,278,377; 6,243,003; 6,250,148; 6,172,613 and/or 6,087,953,and/or U.S. Publication No. US-2009-0295181, which are all herebyincorporated herein by reference in their entireties.

As shown in FIG. 3, the automotive camera system 10 comprises a lensholder assembly 16 which is connected by screws 18 to an upper cover 12a. A processing board 20 is provided which comprises an image processor.The camera system is closed by lower cover 12 b, which is connected tothe upper cover by fasteners or screws 22. In the illustratedembodiment, the camera is part of a forward camera module that viewsforwardly through a windshield of a vehicle. However, although shown anddescribed above as being suitable for use with a forward facing cameraand camera module of a vehicle, the cameras and lenses and imagers andthe focusing and alignment and attachment processes and means describedherein are suitable for use in other vehicle cameras, such as interiorviewing cameras and/or other exterior viewing cameras or camera modules,such as rear backup cameras or side view cameras or exterior viewingcameras for a surround view system or the like.

The lens holder assembly 16 is shown in more detail in FIG. 4. In theillustrated embodiment, the lens holder assembly comprises an imagercircuit element or printed circuit board (PCB) 24 at which an imagesensor 25 is disposed, such as via soldering of the imager onto the PCB.Image sensor 25 and imager PCB 24 are operatively connected to theprocessing board or main circuit board 20, such as via a flexible ribboncable or other suitable electrical connector. The imager PCB 24 ismounted to lens holder 26 by two fasteners or screws 28. Lens 14 isattached (such as via adhesive) to lens holder 26 such that the lens isfocused and aligned relative to image sensor 25 when the lens and lensholder are secured relative to the imager PCB.

The lens holder assembly 16 as described requires an assembly step ofattaching the lens holder 26 to the imager PCB 24, such as by fastenersor fastening screws 28 or the like. This attachment step requires timeand separate additional fasteners and thus adds to the assembly processand cost. Additionally, a gasket 27 may be required to seal the imagesensor 25 from dust and stray light.

The present invention provides an improved lens holder 30, which isshown in FIG. 5. Lens holder 30 comprises a generally cylindricalplastic lens retaining element or member 31 having a surface or end orend region 36 configured for attaching the lens thereat. The lens may beattached via any suitable manner, and is preferably adhered or bonded orglued to surface 36 with an UV-curable adhesive. At least one andpreferably two or more retaining elements or metal inserts 32 is/areinsert molded into the plastic lens retaining member 31 (such as viainjection molding of the lens retaining member about the metal insert toinsert mold the pin or insert into the lens retaining member). Eachmetal insert 32 includes a pin portion or end portion 33 that extendsfrom the end or bottom or engaging portion of the lens retaining memberand is received through a corresponding aperture or recess establishedat or through the imager PCB 34, whereby the pins are disposed at andmay be soldered onto the imager PCB 34 (such as via soldering the pinsat the back surface of the PCB opposite the surface where the imager isdisposed or established, such as via standard soldering techniques ofthe likes used to solder the circuitry at the PCB). Thus, lens holder 30is placed at the imager PCB 34 as a surface-mount component after theimage sensor 35 has been placed onto or established at the imager PCB34. For example, the pins or ends 33 of the metal inserts 32 may bealigned with respective holes or apertures or recesses formed at or inor through the imager PCB and the ends of the pins that protrude throughthe back side or other side of the PCB may be soldered at the imager PCBto secure the lens holder relative to the PCB. The PCB and lens holderassembly may then be conveyed into and through an oven (that heats theassembly to solder and secure the circuitry at the PCB) and the pins(and lens holder) are soldered in place relative to the PCB.

As illustrated, the pins 33 may utilize “pin in paste” soldering andengage or receive or insert into the apertures in the PCB, whereby theends 33 of the pins that protrude through the imager PCB may be solderedat the PCB to connect the lens retaining member 31 of lens holder 30 tothe imager PCB 34. Optionally, in an alternative embodiment, the pins 33may be angled and soldered onto pads on the imager PCB 34 so as to notrequire holes in or through the imager PCB 34.

Optionally, the lens retaining member 31 may be plated at its lower orPCB engaging end and then placed at a solder paste established on theimager side of the PCB. Then, when the lens retaining member 31 isplaced at the PCB 34 and heated, it is soldered in place. After the lensretaining member or barrel is affixed at the imager PCB (either via thepins or plated end or the like), the lens is then placed and/or adjustedor set to actively align the lens with the imager.

The metal insert or retaining element of the lens holder may compriseany suitable configuration and may comprise a pin 33 or pins thatprotrude from the lens retaining member and are received into holes orapertures at or through the imager PCB when the lens holder is attachedat the imager PCB. The lens retaining member thus may be “plugged” intothe imager PCB and soldered or otherwise affixed thereat. Optionally,the lens retaining member may comprise apertures or hollow receiversthat receive pins that protrude from the imager PCB, whereby the pinsmay be soldered at the PCB and, after they are received in the aperturesof the lens retaining member, may be soldered or bonded or otherwiseaffixed at the lens retaining member. Optionally, the PCB or the lensretaining member may comprise an annular channel (such as a metallicannular shaped channel element that may be insert molded into the end ofthe lens holder) that receives a plurality of pins of the lens retainingmember or the imager PCB therein at different locations around thecircumference of the lens holder when the lens holder is disposed atand/or attached at the imager PCB. The various metal inserts or pins areconfigured to engage the PCB or protrude through the PCB or engage pinsattached at the PCB, whereby the metal inserts are soldered at the PCBto affix the lens retaining member relative to the PCB.

Optionally, the plastic lens retaining member 31 preferably comprises anattachment feature (not shown) for mounting the lens holder assembly(comprising the lens 14, lens holder 30 and imager PCB 34) to a cover(such as to upper cover 12 a, discussed above). The imager PCB 34 maythen be held only by solder joints which connect pins 33 with the imagerPCB 34.

Optionally, and with reference to FIGS. 6-9, a lens holder 130 (forholding a lens 114) includes a base or attaching portion 130 a with aplurality of pins or elements 133 extending therefrom for attaching thelens holder 130 to a circuit board or PCB 134. In the illustratedembodiment, the pins 133 are arranged along opposite perimeter regionsof a generally square-shaped or rectangular-shaped base 130 a, and arereceived in correspondingly formed and arranged holes or apertures 134 aof the circuit board 134. Thus, when the lens holder 130 is mounted atthe circuit board 134, the pins 133 are received through the apertures134 a of the circuit board 134, so that the pins protrude slightly fromthe opposite side of the circuit board (such as shown in FIGS. 8 and 9).The pins 133 may then be soldered or otherwise retained at the oppositeside of the circuit board 134 from the lens and lens holder, and thesolder may be applied and melted and cured during the application,melting and curing of the solder of the circuitry of the circuit board.

Thus, the present invention provides a lens holder that has an enhancedattachment at the imager PCB, thus providing a reduced cost and reducedprocessing assembly of the lens and imager and PCB. The lens holderattachment configuration of the present invention includes retainingelements that are insert molded into a plastic lens holding element ormember and that comprise pins or retaining elements that engage and/orprotrude through the imager PCB and that are soldered thereat to secureor retain or attach the lens holder at the imager PCB, without use offasteners or screws. The present invention thus provides a fastenerlesssurface mount or surface attachment of the lens holder to the imagercircuit board without use of additional or separate fasteners or screws.Thus, the present invention provides a camera assembly for a forwardfacing camera module of a vehicle that has fewer components and iseasier to assemble.

Optionally, and as shown in FIGS. 10-14, the posts or pins may beadhered at the lens housing or lens holder, such as via any suitableadhesive, and the circuit board may be soldered at the pins to attachthe circuit board to the pins or posts and to the lens housing or lensholder. The circuit board may initially receive the pins or poststhrough apertures at perimeter regions of the circuit board (such as atthe corners as shown in FIGS. 10-14, or any other suitable locationaround or along a periphery of the circuit board and/or lens holder orhousing). The apertures of the circuit board may be slightly oversizedrelative to the diameter of the pins, so that when the pins are receivedthrough the apertures of the circuit board, the circuit board islaterally adjustable relative to the lens to allow for alignment andfocusing of the lens at the imager of the circuit board. After the lensis brought into alignment and focus with the imager, the pins may besoldered to the circuit board to hold the lens in focus and alignmentwith the imager.

The lens or lens housing or assembly thus may have two or more pins orposts or pads for the PCB attachment or securement. The posts may beinsert molded into the plastic housing or may be otherwise secured tothe plastic housing (or to a metal housing or other substrate ormaterial, depending on the camera application). Optionally, for ametallic lens housing or holder, the pins or posts may be incorporatedinto the housing design and formed with or as part of the metallichousing.

As can be seen with reference to FIG. 14, the lens assembly (with postsprotruding therefrom) and the circuit board may be provided as separatecomponents and may be moved to an active focus and alignment processingarea of the manufacturing facility where the cameras are manufacturedand assembled. With the pins received through the apertures in thecircuit board, the lens and circuit board are adjusted relative to oneanother to actively focus and align the lens with the imager or imagingarray of the circuit board. When the lens and imager are aligned, solderis used to secure the posts at the circuit board and thus to secure thecircuit board and imager relative to the lens housing and lens assembly,so as to maintain the alignment and focus of the lens relative to theimager of the circuit board. The solder may be applied before or duringthe aligning and focusing process, whereby the solder is heated and ispliable during the process and is cured or cooled and hardened after thelens is aligned and focused to the imager, or the solder may be appliedafter the lens is aligned and focused to the imager, whereby the lensand circuit board are fixture or held during the solder application andcooling and hardening process, while remaining within the spirit andscope of the present invention.

Optionally, the lens assembly of the lens barrel may be attached oradhered directly to the circuit board, thereby obviating the need forthe lens holder. For example, and with reference to FIGS. 15-22, animager assembly 216 includes an imager circuit element or printedcircuit board (PCB) 224 at which an image sensor 225 (FIGS. 19A-21), isdisposed, such as via soldering of the imager onto the PCB. Image sensor225 and imager PCB 224 are operatively connected to the processing boardor main circuit board, such as via a flexible ribbon cable or othersuitable electrical connector. The lens assembly or lens or lens barrel214 is attached at the PCB 224, without an additional lens holder, withthe imager assembly 216 including a pair of case mounts or clips 228 forattaching the imager assembly to the camera housing (such as a camerahousing similar to covers 12 a, 12 b of FIG. 3).

In the illustrated embodiment, the imager PCB 224 includes a pair ofapertures or holes 224 a at either side of the image sensor 225 (butthey could be located elsewhere at the PCB) for receiving tabs 228 a ofthe clips 228 to position the clips at the appropriate or selected ordesigned location at the PCB 224. The clips 228 also include attachmenttabs or pads 228 b that engage or contact solder pads or the like at thePCB 224 when the tabs 228 a are received in the holes 224 a of the PCB224. Thus, and as can be seen with reference to FIGS. 19A-C and 20, theclips 228 may be positioned at the PCB and located thereat via insertionof the tabs 228 a into the holes 224 a, whereby the clips may be securedat or to the PCB, such as via soldering the tabs 228 b at the solderpads at the PCB 224. In the illustrated embodiment, the clips 228include a pair of attachment portions or arms, each having a guide tab228 a and a pair of solder tabs 228 b, but other attachmentconfigurations may be achieved while remaining within the spirit andscope of the present invention. For example, two or more tabs or postsof the clips may be inserted through holes and soldered thereat, such asvia the soldering means discussed above.

As shown in FIGS. 21 and 22, lens 214 is attached (such as via adhesive)to PCB 224 such that the lens is focused and aligned relative to imagesensor 225 when the lens is secured relative to the imager PCB. The lensmay be attached via any suitable manner, and is preferably adhered orbonded or glued to the surface of the PCB 224 with a UV-curableadhesive. As shown in FIG. 21, an adhesive strip or band or bead 230 maybe dispensed at the surface of the PCB 224 and around the imager 225,whereby the lens is then placed at the adhesive and adjusted or set toactively align the lens with the imager. For example, the adhesive maycomprise a UV-activated adhesive and the lens may be positioned at theadhesive, whereby the lens is aligned and focused relative to the imager225 before activating the adhesive to secure the lens relative to theimager and PCB.

The imager assembly of the present invention thus eliminates the needfor a plastic lens holder. Instead, two steel clips are soldered orotherwise attached at the imager PCB and serve to attach the imager PCBto the housing of the camera. For example, the tabs 228 c, 228 d of theclips 228 may attach at or to respective tabs or bosses of the camerahousing, such as via a fastener that may insert through the holes 228 ein the tabs 228 d of the clips 228. The UV-activated adhesive isdispensed directly onto the PCB, and the lens is adhered onto the PCBafter it has been activated and aligned.

Optionally, it is envisioned that instead of using adhesive to attachthe lens directly onto the PCB, the lens may be attached viapiezo-electric elements. For example, the piezo-electric elements may beattached or soldered onto the PCB, whereby the lens may be adhered ontothe piezo-electric elements. Using an auto-focus algorithm, a voltagemay be applied to the piezo-elements while driving, whereby thepiezo-electric elements may adjust the lens relative to the imager andPCB, thereby compensating for any defocusing or misalignment that mayoccur due to material expansion of the lens or PCB or other cameracomponents that typically occurs with temperature or humidity changes.

Optionally, the forward facing camera may be disposed at or housed at acasing or module (such as at a windshield electronics module or thelike) that is configured to attach at an interior or in-cabin surface ofa vehicle windshield. Optionally, the module and camera may utilizeaspects of the imaging systems and/or modules discussed above or such asdescribed in U.S. Pat. Nos. 8,256,821; 7,946,505; 7,188,963; 7,004,593;6,824,281; 6,968,736; 6,690,268; 6,250,148; 6,341,523; 6,593,565;6,428,172; 6,501,387; 6,329,925 and 6,326,613, and/or in U.S. patentapplication Ser. No. 10/538,724, filed Jun. 13, 2005 and published Mar.9, 2006 as U.S. Publication No. US-2006-0050018, and/or U.S. patentapplication Ser. No. 13/258,850, filed Sep. 22, 2011, now U.S. Pat. No.8,451,332, which are all hereby incorporated herein by reference intheir entireties. Optionally, the forward facing camera may be disposedat a module that is spaced from the windshield, such as at or near orpart of the interior rearview mirror assembly, or the forward facingcamera may be disposed at or in the interior rearview mirror assemblythat is attached at an in-cabin portion of the vehicle, while remainingwithin the spirit and scope of the present invention.

Optionally, the camera module or forward facing imaging (FFI) machinevision camera module may include a stray light shield that may include alight baffling or light trapping structure or configuration or systemthat limits or reduces extraneous light that passes through a window orwindshield of the equipped vehicle from exterior the vehicle from beingdirectly or indirectly imaged by the forward facing camera that is at ornear the windshield and that views through the windshield.

Optionally, baffles or light baffling elements of the baffleconfiguration or structure may be disposed or established at a plate orsubstrate, which may be disposed at or in the module and may be arrangedgenerally horizontally in front of and below the imaging sensor (or alens or optical assembly of the imaging sensor or camera), with thebaffles extending laterally in a cross car direction in front of theimaging sensor or camera. The baffles or light baffling elements may begenerally vertically arranged at the plate or substrate or base of thebaffle structure, so that the light baffling elements may be generallyvertically oriented when the base of the structure is generallyhorizontally disposed at the vehicle (with selected angles of theopposite surfaces of the light baffling elements as discussed below).

The camera holder or module (including the camera and housing portion)may be configured to attach to a bracket that is attachable at thein-cabin surface of the vehicle windshield, such as via attachment toone or more attachment elements adhesively attached at the in-cabinsurface of the vehicle windshield. The bracket may have an aperture forat least partially receiving and/or aligning with the camera and lens,such that the camera views through the windshield of the vehicle whenthe camera holder is attached at the bracket that is attached at thewindshield. The camera holder and/or the bracket and/or a separateelement provides a light shield having a wedge-shaped or tapered recessor pocket at the camera lens, whereby the camera views through therecess or pocket and through the windshield (such as by utilizingaspects of the camera systems described in U.S. Pat. Nos. 8,256,821and/or 6,824,281, and/or U.S. patent application Ser. No. 13/470,860,filed May 14, 2012, now U.S. Pat. No. 8,405,726, which are herebyincorporated herein by reference in their entireties). The wedge-shapedrecess or pocket may be defined or formed by a base portion and oppositesidewalls that taper towards the lens and that extend generally upwardsfrom the base portion to form the wedge-shaped recess or pocket betweenthe in-cabin surface of the windshield and the base portion.

Because of the number of components established at the main circuitboard of the camera module, it is desirable to have the main circuitboard comprise a double sided PCB with circuitry and componentsestablished at both sides of the circuit board. The flexible connectoror cable provides LVDS signals conveying image data captured by theimager to the image processor of the main circuit board. Alternately,image data captured by the imager may be conveyed to the image processorvia the likes of Ethernet or by the protocols described in U.S. Pat. No.7,697,027, which is hereby incorporated herein by reference in itsentirety. The aperture or opening or hole in the main circuit boardprovides for passage of the flexible connector through the circuit boardso as to establish electrical connection to the opposite side of themain circuit board, and the aperture or opening or hole in the maincircuit board also at least partially receives a portion of imagerassembly (such as a portion of the imager circuit board and/or imagerand/or lens holder and/or lens) to provide a lower profile camera systemor module.

Optionally, the camera module may include ventilation means forventilating the module at the windshield (such as by utilizing aspectsof the modules described in U.S. patent application Ser. No. 11/721,406,filed Jun. 11, 2007 and published Dec. 3, 2009 as U.S. Publication No.US-2009-0295181, and/or U.S. patent application Ser. No. 12/393,223,filed Feb. 26, 2009, now abandoned, which are hereby incorporated hereinby reference in their entireties).

The camera or sensor may comprise any suitable camera or sensor.Optionally, the camera may comprise a “smart camera” that includes theimaging sensor array and associated circuitry and image processingcircuitry and electrical connectors and the like as part of a cameramodule, such as by utilizing aspects of the vision systems described inInternational Publication Nos. WO 2013/081984 and/or WO 2013/081985,which are hereby incorporated herein by reference in their entireties.

The system includes an image processor operable to process image datacaptured by the camera or cameras, such as for detecting objects orother vehicles or pedestrians or the like in the field of view of one ormore of the cameras. For example, the image processor may comprise anEYEQ2 or EYEQ3 image processing chip available from Mobileye VisionTechnologies Ltd. of Jerusalem, Israel, and may include object detectionsoftware (such as the types described in U.S. Pat. Nos. 7,855,755;7,720,580 and/or 7,038,577, which are hereby incorporated herein byreference in their entireties), and may analyze image data to detectvehicles and/or other objects. Responsive to such image processing, andwhen an object or other vehicle is detected, the system may generate analert to the driver of the vehicle and/or may generate an overlay at thedisplayed image to highlight or enhance display of the detected objector vehicle, in order to enhance the driver's awareness of the detectedobject or vehicle or hazardous condition during a driving maneuver ofthe equipped vehicle.

The vehicle may include any type of sensor or sensors, such as imagingsensors or radar sensors or lidar sensors or ladar sensors or ultrasonicsensors or the like. The imaging sensor or camera may capture image datafor image processing and may comprise any suitable camera or sensingdevice, such as, for example, a two dimensional array of a plurality ofphotosensor elements arranged in at least 640 columns and 480 rows (atleast a 640×480 imaging array, such as a megapixel imaging array or thelike), with a respective lens focusing images onto respective portionsof the array. The photosensor array may comprise a plurality ofphotosensor elements arranged in a photosensor array having rows andcolumns. Preferably, the imaging array has at least 300,000 photosensorelements or pixels, more preferably at least 500,000 photosensorelements or pixels and more preferably at least 1 million photosensorelements or pixels. The imaging array may capture color image data, suchas via spectral filtering at the array, such as via an RGB (red, greenand blue) filter or via a red/red complement filter or such as via anRCC (red, clear, clear) filter or the like. The logic and controlcircuit of the imaging sensor may function in any known manner, and theimage processing and algorithmic processing may comprise any suitablemeans for processing the images and/or image data.

For example, the vision system and/or processing and/or camera and/orcircuitry may utilize aspects described in U.S. Pat. Nos. 7,005,974;5,760,962; 5,877,897; 5,796,094; 5,949,331; 6,222,447; 6,302,545;6,396,397; 6,498,620; 6,523,964; 6,611,202; 6,201,642; 6,690,268;6,717,610; 6,757,109; 6,802,617; 6,806,452; 6,822,563; 6,891,563;6,946,978; 7,859,565; 5,550,677; 5,670,935; 6,636,258; 7,145,519;7,161,616; 7,230,640; 7,248,283; 7,295,229; 7,301,466; 7,592,928;7,881,496; 7,720,580; 7,038,577; 6,882,287; 5,929,786 and/or 5,786,772,and/or International Publication Nos. WO 2011/028686; WO 2010/099416; WO2012/061567; WO 2012/068331; WO 2012/075250; WO 2012/103193; WO2012/0116043; WO 2012/0145313; WO 2012/0145501; WO 2012/145818; WO2012/145822; WO 2012/158167; WO 2012/075250; WO 2012/0116043; WO2012/0145501; WO 2012/154919; WO 2013/019707; WO 2013/016409; WO2013/019795; WO 2013/067083; WO 2013/070539; WO 2013/043661; WO2013/048994; WO 2013/063014, WO 2013/081984; WO 2013/081985; WO2013/074604; WO 2013/086249; WO 2013/103548; WO 2013/109869; WO2013/123161; WO 2013/126715; WO 2013/043661 and/or WO 2013/158592,and/or U.S. patent application Ser. No. 14/248,602, filed Apr. 9, 2014,now U.S. Pat. No. 9,327,693; Ser. No. 14/242,038, filed Apr. 1, 2014,now U.S. Pat. No. 9,487,459; Ser. No. 14/229,061, filed Mar. 28, 2014,now U.S. Pat. No. 10,027,930; Ser. No. 14/343,937, filed Mar. 10, 2014,now U.S. Pat. No. 9,681,062; Ser. No. 14/343,936, filed Mar. 10, 2014,and published Aug. 7, 2014 as U.S. Patent Publication No.US-2014/0218535; Ser. No. 14/195,135, filed Mar. 3, 2014, now U.S. Pat.No. 9,688,200; Ser. No. 14/195,136, filed Mar. 3, 2014, now U.S. Pat.No. 10,057,544; Ser. No. 14/191,512, filed Feb. 27, 2014, whichpublished Sep. 4, 2014 as U.S. Patent Publication No. US-2014/0247352;Ser. No. 14/183,613, filed Feb. 19, 2014, now U.S. Pat. No. 9,445,057;Ser. No. 14/169,329, filed Jan. 31, 2014, and published Aug. 7, 2014 asU.S. Patent Publication No. 2014/0218529; Ser. No. 14/169,328, filedJan. 31, 2014, now U.S. Pat. No. 9,092,986; Ser. No. 14/163,325, filedJan. 24, 2014, and published Jul. 31, 2014 as U.S. Patent PublicationNo. 2014/0211009; Ser. No. 14/159,772, filed Jan. 21, 2014, now U.S.Pat. No. 9,068,390; Ser. No. 14/107,624, filed Dec. 16, 2013, now U.S.Pat. No. 9,140,789; Ser. No. 14/102,981, filed Dec. 11, 2013, now U.S.Pat. No. 9,558,409; Ser. No. 14/102,980, filed Dec. 11, 2013, andpublished Jun. 19, 2014 as U.S. Patent Publication No. US-2014/0168437;Ser. No. 14/098,817, filed Dec. 6, 2013, and published Jun. 19, 2014 asU.S. Patent Publication No. US-2014/0168415; Ser. No. 14/097,581, filedDec. 5, 2013, now U.S. Pat. No. 9,481,301; Ser. No. 14/093,981, filedDec. 2, 2013, now U.S. Pat. No. 8,917,169; Ser. No. 14/093,980, filedDec. 2, 2013, now U.S. Pat. No. 10,025,994; Ser. No. 14/082,573, filedNov. 18, 2013, now U.S. Pat. No. 9,743,002; Ser. No. 14/082,574, filedNov. 18, 2013, now U.S. Pat. No. 9,307,640; Ser. No. 14/082,575, filedNov. 18, 2013, now U.S. Pat. No. 9,090,234; Ser. No. 14/082,577, filedNov. 18, 2013, now U.S. Pat. No. 8,818,042; Ser. No. 14/071,086, filedNov. 4, 2013, now U.S. Pat. No. 8,886,401; Ser. No. 14/076,524, filedNov. 11, 2013, now U.S. Pat. No. 9,077,962; Ser. No. 14/052,945, filedOct. 14, 2013, now U.S. Pat. No. 9,707,896; Ser. No. 14/046,174, filedOct. 4, 2013, now U.S. Pat. No. 9,723,272; Ser. No. 14/016,790, filedOct. 3, 2013, now U.S. Pat. No. 9,761,142; Ser. No. 14/036,723, filedSep. 25, 2013, now U.S. Pat. No. 9,446,713; Ser. No. 14/016,790, filedSep. 3, 2013, now U.S. Pat. No. 9,761,142; Ser. No. 14/001,272, filedAug. 23, 2013, now U.S. Pat. No. 9,233,641; Ser. No. 13/970,868, filedAug. 20, 2013, now U.S. Pat. No. 9,365,162; Ser. No. 13/964,134, filedAug. 12, 2013, now U.S. Pat. No. 9,340,227; Ser. No. 13/942,758, filedJul. 16, 2013, and published Jan. 23, 2014 as U.S. Patent PublicationNo. US-2014/0025240; Ser. No. 13/942,753, filed Jul. 16, 2013, andpublished Jan. 30, 2014 as U.S. Patent Publication No. US-2014/0028852;Ser. No. 13/927,680, filed Jun. 26, 2013, and published Jan. 2, 2014 asU.S. Patent Publication No. US-2014/0005907; Ser. No. 13/916,051, filedJun. 12, 2013, now U.S. Pat. No. 9,077,098; Ser. No. 13/894,870, filedMay 15, 2013, now U.S. Pat. No. 10,089,537; Ser. No. 13/887,724, filedMay 6, 2013, now U.S. Pat. No. 9,670,895; Ser. No. 13/852,190, filedMar. 28, 2013, and published Aug. 29, 2013 as U.S. Patent PublicationNo. US-2013/0222593; Ser. No. 13/851,378, filed Mar. 27, 2013, now U.S.Pat. No. 9,319,637; Ser. No. 13/848,796, filed Mar. 22, 2012, andpublished Oct. 24, 2013 as U.S. Patent Publication No. US-2013/0278769;Ser. No. 13/847,815, filed Mar. 20, 2013, and published Oct. 31, 2013 asU.S. Patent Publication No. US-2013/0286193; Ser. No. 13/800,697, filedMar. 13, 2013, and published Oct. 3, 2013 as U.S. Patent Publication No.US-2013/0258077; Ser. No. 13/785,099, filed Mar. 5, 2013, now U.S. Pat.No. 9,565,342; Ser. No. 13/779,881, filed Feb. 28, 2013, now U.S. Pat.No. 8,694,224; Ser. No. 13/774,317, filed Feb. 22, 2013, now U.S. Pat.No. 9,269,263; Ser. No. 13/774,315, filed Feb. 22, 2013, and publishedAug. 22, 2013 as U.S. Patent Publication No. US-2013/0215271; Ser. No.13/681,963, filed Nov. 20, 2012, now U.S. Pat. No. 9,264,673; Ser. No.13/660,306, filed Oct. 25, 2012, now U.S. Pat. No. 9,146,898; Ser. No.13/653,577, filed Oct. 17, 2012, now U.S. Pat. No. 9,174,574; and/orSer. No. 13/534,657, filed Jun. 27, 2012, and published Jan. 3, 2013 asU.S. Patent Publication No. US-2013/0002873, and/or U.S. provisionalapplications, Ser. No. 61/977,941, filed Apr. 10, 2014; Ser. No.61/977,940. filed Apr. 10, 2014; Ser. No. 61/977,929, filed Apr. 10,2014; Ser. No. 61/977,928, filed Apr. 10, 2014; Ser. No. 61/973,922,filed Apr. 2, 2014; Ser. No. 61/972,708, filed Mar. 31, 2014; Ser. No.61/972,707, filed Mar. 31, 2014; Ser. No. 61/969,474, filed Mar. 24,2014; Ser. No. 61/955,831, filed Mar. 20, 2014; Ser. No. 61/953,970,filed Mar. 17, 2014; Ser. No. 61/952,335, filed Mar. 13, 2014; Ser. No.61/952,334, filed Mar. 13, 2014; Ser. No. 61/950,261, filed Mar. 10,2014; Ser. No. 61/950,261, filed Mar. 10, 2014; Ser. No. 61/947,638,filed Mar. 4, 2014; Ser. No. 61/947,053, filed Mar. 3, 2014; Ser. No.61/941,568, filed Feb. 19, 2014; Ser. No. 61/935,485, filed Feb. 4,2014; Ser. No. 61/935,057, filed Feb. 3, 2014; Ser. No. 61/935,056,filed Feb. 3, 2014; Ser. No. 61/935,055, filed Feb. 3, 2014; Ser.61/931,811, filed Jan. 27, 2014; Ser. No. 61/919,129, filed Dec. 20,2013; Ser. No. 61/919,130, filed Dec. 20, 2013; Ser. No. 61/919,131,filed Dec. 20, 2013; Ser. No. 61/919,147, filed Dec. 20, 2013; Ser. No.61/919,138, filed Dec. 20, 2013, Ser. No. 61/919,133, filed Dec. 20,2013; Ser. No. 61/915,218, filed Dec. 12, 2013; Ser. No. 61/912,146,filed Dec. 5, 2013; Ser. No. 61/911,666, filed Dec. 4, 2013; Ser. No.61/911,665, filed Dec. 4, 2013; Ser. No. 61/905,461, filed Nov. 18,2013; Ser. No. 61/905,462, filed Nov. 18, 2013; Ser. No. 61/901,127,filed Nov. 7, 2013; Ser. No. 61/895,610, filed Oct. 25, 2013; Ser. No.61/895,609, filed Oct. 25, 2013; Ser. No. 61/879,837, filed Sep. 19,2013; Ser. No. 61/879,835, filed Sep. 19, 2013; Ser. No. 61/878,877,filed Sep. 17, 2013; Ser. No. 61/869,195, filed. Aug. 23, 2013; Ser. No.61/864,835, filed Aug. 12, 2013; Ser. No. 61/864,836, filed Aug. 12,2013; Ser. No. 61/864,837, filed Aug. 12, 2013; Ser. No. 61/864,838,filed Aug. 12, 2013; Ser. No. 61/856,843, filed Jul. 22, 2013, Ser. No.61/845,061, filed Jul. 11, 2013; Ser. No. 61/844,630, filed Jul. 10,2013; Ser. No. 61/844,173, filed Jul. 9, 2013; Ser. No. 61/844,171,filed Jul. 9, 2013; Ser. No. 61/842,644, filed Jul. 3, 2013; Ser. No.61/840,542, filed Jun. 28, 2013; Ser. No. 61/838,619, filed Jun. 24,2013; Ser. No. 61/838,621, filed Jun. 24, 2013; Ser. No. 61/837,955,filed Jun. 21, 2013; Ser. No. 61/836,900, filed Jun. 19, 2013; Ser. No.61/836,380, filed Jun. 18, 2013; Ser. No. 61/833,080, filed Jun. 10,2013; Ser. No. 61/830,375, filed Jun. 3, 2013; Ser. No. 61/830,377,filed Jun. 3, 2013; Ser. No. 61/825,752, filed May 21, 2013; Ser. No.61/825,753, filed May 21, 2013; Ser. No. 61/823,648, filed May 15, 2013;Ser. No. 61/821,922, filed May 10, 2013; Ser. No. 61/819,835, filed May6, 2013; Ser. No. 61/819,033, filed May 3, 2013; Ser. No. 61/816,956,filed Apr. 29, 2013; and/or Ser. No. 61/813,361, filed Apr. 18, 2013,which are all hereby incorporated herein by reference in theirentireties. The system may communicate with other communication systemsvia any suitable means, such as by utilizing aspects of the systemsdescribed in International Publication Nos. WO/2010/144900; WO2013/043661 and/or WO 2013/081985, and/or U.S. patent application Ser.No. 13/202,005, filed Aug. 17, 2011, now U.S. Pat. No. 9,126,525, whichare hereby incorporated herein by reference in their entireties.

The imaging device and control and image processor and any associatedillumination source, if applicable, may comprise any suitablecomponents, and may utilize aspects of the cameras and vision systemsdescribed in U.S. Pat. Nos. 5,550,677; 5,877,897; 6,498,620; 5,670,935;5,796,094; 6,396,397; 6,806,452; 6,690,268; 7,005,974; 7,937,667;7,123,168; 7,004,606; 6,946,978; 7,038,577; 6,353,392; 6,320,176;6,313,454 and 6,824,281, and/or International Publication Nos. WO2010/099416; WO 2011/028686 and/or WO 2013/016409, and/or U.S. Pat.Publication No. US 2010-0020170, and/or U.S. patent application Ser. No.13/534,657, filed Jun. 27, 2012, and published Jan. 3, 2013 as U.S.Patent Publication No. US-2013/0002873, which are all herebyincorporated herein by reference in their entireties. The camera orcameras may comprise any suitable cameras or imaging sensors or cameramodules, and may utilize aspects of the cameras or sensors described inU.S. patent application Ser. No. 12/091,359, filed Apr. 24, 2008 andpublished Oct. 1, 2009 as U.S. Publication No. US-2009-0244361; and/orSer. No. 13/260,400, filed Sep. 26, 2011, now U.S. Pat. Nos. 8,542,451,and/or 7,965,336 and/or 7,480,149, which are hereby incorporated hereinby reference in their entireties. The imaging array sensor may compriseany suitable sensor, and may utilize various imaging sensors or imagingarray sensors or cameras or the like, such as a CMOS imaging arraysensor, a CCD sensor or other sensors or the like, such as the typesdescribed in U.S. Pat. Nos. 5,550,677; 5,670,935; 5,760,962; 5,715,093;5,877,897; 6,922,292; 6,757,109; 6,717,610; 6,590,719; 6,201,642;6,498,620; 5,796,094; 6,097,023; 6,320,176; 6,559,435; 6,831,261;6,806,452; 6,396,397; 6,822,563; 6,946,978; 7,339,149; 7,038,577;7,004,606; 7,720,580 and/or 7,965,336, and/or International PublicationNos. WO/2009/036176 and/or WO/2009/046268, which are all herebyincorporated herein by reference in their entireties.

The camera module and circuit chip or board and imaging sensor may beimplemented and operated in connection with various vehicularvision-based systems, and/or may be operable utilizing the principles ofsuch other vehicular systems, such as a vehicle headlamp control system,such as the type disclosed in U.S. Pat. Nos. 5,796,094; 6,097,023;6,320,176; 6,559,435; 6,831,261; 7,004,606; 7,339,149 and/or 7,526,103,which are all hereby incorporated herein by reference in theirentireties, a rain sensor, such as the types disclosed in commonlyassigned U.S. Pat. Nos. 6,353,392; 6,313,454; 6,320,176 and/or7,480,149, which are hereby incorporated herein by reference in theirentireties, a vehicle vision system, such as a forwardly, sidewardly orrearwardly directed vehicle vision system utilizing principles disclosedin U.S. Pat. Nos. 5,550,677; 5,670,935; 5,760,962; 5,877,897; 5,949,331;6,222,447; 6,302,545; 6,396,397; 6,498,620; 6,523,964; 6,611,202;6,201,642; 6,690,268; 6,717,610; 6,757,109; 6,802,617; 6,806,452;6,822,563; 6,891,563; 6,946,978 and/or 7,859,565, which are all herebyincorporated herein by reference in their entireties, a trailer hitchingaid or tow check system, such as the type disclosed in U.S. Pat. No.7,005,974, which is hereby incorporated herein by reference in itsentirety, a reverse or sideward imaging system, such as for a lanechange assistance system or lane departure warning system or for a blindspot or object detection system, such as imaging or detection systems ofthe types disclosed in U.S. Pat. Nos. 7,881,496; 7,720,580; 7,038,577;5,929,786 and/or 5,786,772, and/or U.S. provisional applications, Ser.No. 60/628,709, filed Nov. 17, 2004; Ser. No. 60/614,644, filed Sep. 30,2004; Ser. No. 60/618,686, filed Oct. 14, 2004; Ser. No. 60/638,687,filed Dec. 23, 2004, which are hereby incorporated herein by referencein their entireties, a video device for internal cabin surveillanceand/or video telephone function, such as disclosed in U.S. Pat. Nos.5,760,962; 5,877,897; 6,690,268 and/or 7,370,983, and/or U.S.Publication No. US-2006-0050018, which are hereby incorporated herein byreference in their entireties, a traffic sign recognition system, asystem for determining a distance to a leading or trailing vehicle orobject, such as a system utilizing the principles disclosed in U.S. Pat.Nos. 6,396,397 and/or 7,123,168, which are hereby incorporated herein byreference in their entireties, and/or the like.

Optionally, the circuit board or chip may include circuitry for theimaging array sensor and or other electronic accessories or features,such as by utilizing compass-on-a-chip or EC driver-on-a-chip technologyand aspects such as described in U.S. Pat. Nos. 7,255,451 and/or7,480,149; and/or U.S. Publication No. US-2006-0061008, and/or Ser. No.12/578,732, filed Oct. 14, 2009, now U.S. Pat. No. 9,487,144, which arehereby incorporated herein by reference in their entireties.

Optionally, the vision system may include a display for displayingimages captured by one or more of the imaging sensors for viewing by thedriver of the vehicle while the driver is normally operating thevehicle. Optionally, for example, the vision system may include a videodisplay device disposed at or in the interior rearview mirror assemblyof the vehicle, such as by utilizing aspects of the video mirror displaysystems described in U.S. Pat. No. 6,690,268 and/or U.S. patentapplication Ser. No. 13/333,337, filed Dec. 21, 2011, now U.S. Pat. No.9,264,672, which are hereby incorporated herein by reference in theirentireties. The video mirror display may comprise any suitable devicesand systems and optionally may utilize aspects of the compass displaysystems described in U.S. Pat. Nos. 7,370,983; 7,329,013; 7,308,341;7,289,037; 7,249,860; 7,004,593; 4,546,551; 5,699,044; 4,953,305;5,576,687; 5,632,092; 5,677,851; 5,708,410; 5,737,226; 5,802,727;5,878,370; 6,087,953; 6,173,508; 6,222,460; 6,513,252 and/or 6,642,851,and/or European patent application, published Oct. 11, 2000 underPublication No. EP 0 1043566, and/or U.S. Publication No.US-2006-0061008, which are all hereby incorporated herein by referencein their entireties. Optionally, the video mirror display screen ordevice may be operable to display images captured by a rearward viewingcamera of the vehicle during a reversing maneuver of the vehicle (suchas responsive to the vehicle gear actuator being placed in a reversegear position or the like) to assist the driver in backing up thevehicle, and optionally may be operable to display the compass headingor directional heading character or icon when the vehicle is notundertaking a reversing maneuver, such as when the vehicle is beingdriven in a forward direction along a road (such as by utilizing aspectsof the display system described in International Publication No. WO2012/051500, which is hereby incorporated herein by reference in itsentirety).

Optionally, the vision system (utilizing the forward facing camera and arearward facing camera and other cameras disposed at the vehicle withexterior fields of view) may be part of or may provide a display of atop-down view or birds-eye view system of the vehicle or a surround viewat the vehicle, such as by utilizing aspects of the vision systemsdescribed in International Publication Nos. WO 2010/099416; WO2011/028686; WO 2012/075250; WO 2013/019795; WO 2012/075250; WO2012/145822; WO 2013/081985; WO 2013/086249 and/or WO 2013/109869,and/or U.S. patent application Ser. No. 13/333,337, filed Dec. 21, 2011,now U.S. Pat. No. 9,264,672, which are hereby incorporated herein byreference in their entireties.

Optionally, a video mirror display may be disposed rearward of andbehind the reflective element assembly and may comprise a display suchas the types disclosed in U.S. Pat. Nos. 5,530,240; 6,329,925;7,855,755; 7,626,749; 7,581,859; 7,446,650; 7,370,983; 7,338,177;7,274,501; 7,255,451; 7,195,381; 7,184,190; 5,668,663; 5,724,187 and/or6,690,268, and/or in U.S. Publication Nos. US-2006-0061008 and/orUS-2006-0050018, which are all hereby incorporated herein by referencein their entireties. The display is viewable through the reflectiveelement when the display is activated to display information. Thedisplay element may be any type of display element, such as a vacuumfluorescent (VF) display element, a light emitting diode (LED) displayelement, such as an organic light emitting diode (OLED) or an inorganiclight emitting diode, an electroluminescent (EL) display element, aliquid crystal display (LCD) element, a video screen display element orbacklit thin film transistor (TFT) display element or the like, and maybe operable to display various information (as discrete characters,icons or the like, or in a multi-pixel manner) to the driver of thevehicle, such as passenger side inflatable restraint (PSIR) information,tire pressure status, and/or the like. The mirror assembly and/ordisplay may utilize aspects described in U.S. Pat. Nos. 7,184,190;7,255,451; 7,446,924 and/or 7,338,177, which are all hereby incorporatedherein by reference in their entireties. The thicknesses and materialsof the coatings on the substrates of the reflective element may beselected to provide a desired color or tint to the mirror reflectiveelement, such as a blue colored reflector, such as is known in the artand such as described in U.S. Pat. Nos. 5,910,854; 6,420,036 and/or7,274,501, which are hereby incorporated herein by reference in theirentireties.

Optionally, the display or displays and any associated user inputs maybe associated with various accessories or systems, such as, for example,a tire pressure monitoring system or a passenger air bag status or agarage door opening system or a telematics system or any other accessoryor system of the mirror assembly or of the vehicle or of an accessorymodule or console of the vehicle, such as an accessory module or consoleof the types described in U.S. Pat. Nos. 7,289,037; 6,877,888;6,824,281; 6,690,268; 6,672,744; 6,386,742 and/or 6,124,886, and/or U.S.Publication No. US-2006-0050018, which are hereby incorporated herein byreference in their entireties.

Changes and modifications to the specifically described embodiments maybe carried out without departing from the principles of the presentinvention, which is intended to be limited only by the scope of theappended claims as interpreted according to the principles of patentlaw.

1. A camera module configured to mount at a receiving structure at aninterior surface of a vehicle windshield of a vehicle equipped with avehicular vision system, said camera module comprising: a camerahousing, a processing circuit board and an imager assembly; wherein saidprocessing circuit board is accommodated in said camera housing; whereinsaid imager assembly comprises an imager, an imager circuit board, alens holder and a lens; wherein said imager circuit board has a firstsurface and a second surface opposite said first surface; wherein saidimager is established at said first surface of said imager circuitboard; wherein said lens holder comprises a lens holding portion and anattaching portion; wherein said lens holding portion of said lens holderaccommodates said lens; wherein said attaching portion of said lensholder of said imager assembly comprises a mating surface that facesaway from said lens holding portion of said lens holder; wherein saidattaching portion comprises a plurality of pins extending from saidmating surface of said attaching portion of said lens holder of saidimager assembly; wherein said mating surface mates with said firstsurface of said imager circuit board when said attaching portion isattached at said imager circuit board; wherein, with said mating surfaceof said attaching portion of said lens holder mated with said firstsurface of said imager circuit board, individual pins of said pluralityof pins are received at least partially through respective apertures ofsaid imager circuit board; wherein, as received at least partiallythrough the respective apertures of said imager circuit board, said pinslocate said lens holder at said imager circuit board; wherein, with saidpins received at least partially through the apertures of said imagercircuit board, said lens is focused and optically aligned with saidimager at said imager circuit board; wherein, with said pins received atleast partially through the apertures of said imager circuit board, andwith said lens focused and optically aligned with said imager at saidimager circuit board, said pins are soldered at said imager circuitboard so as to fixedly attach said lens holder at said imager circuitboard to form said imager assembly; wherein said imager assembly isattached at said camera housing, and wherein circuitry of said imagercircuit board is electrically connected to circuitry of said processingcircuit board via a flexible electrical connector; and wherein, withsaid camera module mounted at the receiving structure at the interiorsurface of the vehicle windshield, said imager assembly views forward ofthe equipped vehicle and through the vehicle windshield.
 2. The cameramodule of claim 1, wherein, with said imager assembly attached at saidcamera housing, said lens holder is disposed at an aperture through saidcamera housing.
 3. The camera module of claim 2, wherein said imagerassembly is attached to an upper housing portion of said camera housing.4. The camera module of claim 1, wherein said lens holder comprises aplastic molded element.
 5. The camera module of claim 4, wherein saidpins of said attaching portion of said lens holder are insert molded atsaid attaching portion of said lens holder and protrude from saidattaching portion of said lens holder.
 6. The camera module of claim 1,wherein said lens holding portion of said lens holder comprises agenerally cylindrical lens barrel that accommodates said lens.
 7. Thecamera module of claim 6, wherein said attaching portion of said lensholder comprises a generally rectangular portion having said pinsdisposed along and protruding from at least one side region of saidattaching portion.
 8. The camera module of claim 7, wherein said pinsare generally linearly disposed along and protruding from opposite sideregions of said attaching portion, and wherein said pins are received atleast partially through respective apertures at said imager circuitboard.
 9. The camera module of claim 1, wherein said plurality of pinscomprises at least two pins that are insert molded at said attachingportion of said lens holder, and wherein respective ends of said atleast two pins protrude from said attaching portion of said lens holderand protrude at least partially into the apertures of said imagercircuit board, and wherein the ends of said at least two pins aresoldered at said imager circuit board to fixedly attach said lens holderat said imager circuit board.
 10. The camera module of claim 1, wherein,with said mating surface of said attaching portion of said lens holdermated with said first surface of said imager circuit board, said pinsprotrude through said imager circuit board and are soldered at saidsecond surface of said imager circuit board.
 11. The camera module ofclaim 1, wherein, with said attaching portion attached at said imagercircuit board, said imager at said first surface of said imager circuitboard is at least partially encased by said attaching portion.
 12. Thecamera module of claim 1, wherein said imager circuit board comprises aprinted circuit board with circuitry disposed thereat.
 13. The cameramodule of claim 12, wherein imager circuit board has said circuitrydisposed at said first surface and said second surface of said imagercircuit board.
 14. The camera module of claim 13, wherein said circuitryis soldered at said first and second surfaces of said imager circuitboard, and wherein the solder that affixes said pins at said imagercircuit board is applied and cured via a common process that applies andcures solder of said circuitry.
 15. A method for assembling a cameramodule for a vehicular vision system, the camera module configured tomount at a receiving structure at an interior surface of a vehiclewindshield of a vehicle equipped with the vehicular vision system, saidmethod comprising: providing a camera housing and a processing circuitboard; providing an imager and an imager circuit board, wherein theimager circuit board has a first surface and a second surface oppositethe first surface; disposing the imager at the first surface of theimager circuit board; providing a lens holder and a lens, wherein thelens holder comprises a lens holding portion and an attaching portion,and wherein the attaching portion of the lens holder comprises a matingsurface that faces away from the lens holding portion of the lensholder, and wherein the attaching portion comprises a plurality of pinsextending from the mating surface of the attaching portion;accommodating the lens in the lens holding portion of the lens holder;locating the lens holder at the imager circuit board by insertingindividual pins of the plurality of pins at least partially throughrespective apertures of the imager circuit board and mating the matingsurface of the attaching portion of the lens holder with the firstsurface of the imager circuit board; with the pins received at leastpartially through the apertures of the imager circuit board, focusingand optically aligning the lens with the imager at the imager circuitboard; with the pins received at least partially through the aperturesof the imager circuit board, and with the lens focused and opticallyaligned with the imager at the imager circuit board, soldering the pinsat the imager circuit board so as to fixedly attach the lens holder atthe imager circuit board to form an imager assembly; accommodating theprocessing circuit board in the camera housing; and attaching the imagerassembly at the camera housing and electrically connecting circuitry ofthe imager circuit board to circuitry of the processing circuit boardvia a flexible electrical connector.
 16. The method of claim 15, whereinattaching the imager assembly at the camera housing comprising attachingthe imager assembly at an upper housing portion of the camera housingwith the lens holder disposed at an aperture through the upper housingportion of the camera housing.
 17. The method of claim 15, whereinproviding the lens holder comprises molding a plastic lens holder withthe pins of the attaching portion of the lens holder insert molded atthe attaching portion of the lens holder so as to protrude from theattaching portion of the lens holder.
 18. The method of claim 15,wherein soldering the pins at the imager circuit board comprisessoldering the pins at the second surface of the imager circuit board.19. The method of claim 15, comprising soldering circuitry at the imagercircuit board, wherein soldering circuitry at the imager circuit boardand soldering the pins at the imager circuit board comprises applyingand curing solder that affixes the pins at the imager circuit board andthat affixes the circuitry at the imager circuit board via a commonprocess.
 20. A camera module configured to mount at a receivingstructure at an interior surface of a vehicle windshield of a vehicleequipped with a vehicular vision system, said camera module comprising:a camera housing, a processing circuit board and an imager assembly;wherein said processing circuit board is accommodated in said camerahousing; wherein said imager assembly comprises an imager, an imagercircuit board, a lens holder and a lens; wherein said imager circuitboard has a first surface and a second surface opposite said firstsurface; wherein said imager is established at said first surface ofsaid imager circuit board; wherein said lens holder comprises a lensholding portion and an attaching portion; wherein said lens holdingportion of said lens holder comprises a generally cylindrical lensbarrel that accommodates said lens; wherein said attaching portion ofsaid lens holder of said imager assembly comprises a mating surface thatfaces away from said lens holding portion of said lens holder; whereinsaid attaching portion comprises a plurality of pins extending from saidmating surface of said attaching portion of said lens holder of saidimager assembly; wherein said mating surface mates with said firstsurface of said imager circuit board when said attaching portion isattached at said imager circuit board; wherein, with said mating surfaceof said attaching portion of said lens holder mated with said firstsurface of said imager circuit board, individual pins of said pluralityof pins are received at least partially through respective apertures ofsaid imager circuit board; wherein, as received at least partiallythrough the respective apertures of said imager circuit board, said pinslocate said lens holder at said imager circuit board; wherein, with saidpins received at least partially through the apertures of said imagercircuit board, said lens is focused and optically aligned with saidimager at said imager circuit board; wherein, with said pins received atleast partially through the apertures of said imager circuit board, andwith said lens focused and optically aligned with said imager at saidimager circuit board, said pins protrude through said imager circuitboard and are soldered at said second surface of said imager circuitboard so as to fixedly attach said lens holder at said imager circuitboard to form said imager assembly; wherein, with said attaching portionof said lens holder attached at said imager circuit board, said imagerat said first surface of said imager circuit board is at least partiallyencased by said attaching portion; wherein said imager assembly isattached at an upper housing portion of said camera housing, and whereincircuitry of said imager circuit board is electrically connected tocircuitry of said processing circuit board via a flexible electricalconnector; wherein, with said imager assembly attached at said upperhousing portion of said camera housing, said lens holder is disposed atan aperture through said upper housing portion of said camera housing;and wherein, with said camera module mounted at the receiving structureat the interior surface of the vehicle windshield, said imager assemblyviews forward of the equipped vehicle and through the vehiclewindshield.
 21. The camera module of claim 20, wherein said lens holdercomprises a plastic molded element, and wherein said pins of saidattaching portion of said lens holder are insert molded at saidattaching portion of said lens holder and protrude from said attachingportion of said lens holder.
 22. The camera module of claim 21, whereinsaid plurality of pins comprises at least two pins that are insertmolded at said attaching portion of said lens holder, and whereinrespective ends of said at least two pins protrude from said attachingportion of said lens holder and protrude at least partially into theapertures of said imager circuit board, and wherein the ends of said atleast two pins are soldered at said second surface of said imagercircuit board to fixedly attach said lens holder at said imager circuitboard.
 23. The camera module of claim 20, wherein circuitry is solderedat said imager circuit board, and wherein the solder that affixes saidpins at said second surface of said imager circuit board is applied andcured via a common process that applies and cures solder that affixesthe circuitry at said imager circuit board.